The different chip attachment technologies that make up an LED
The various Chip Attachment Technologyis a critical factor in determining the performance, reliability, and cost-effectiveness of LED devices. That's why when choosing an LED display, it's important to consider the SMD, GOB, COB (Micro LED) Let's take a look at the technologies and compare their features, pros, and cons.
SMD
GOB
SMD
(Surface-Mounted Device)
The LED chips are attached after the substrate is fabricated. It has the advantage of having a large lamp size, the lowest price, and easy maintenance. It's a popular method for both indoor and outdoor use.
However, they don't have a high contrast ratio, which makes the screen look washed out, and they're not very resistant to external shocks, which can damage the LED elements.
GOB
GOB
(Glue On Board)
Transparent AdhesivesThis protects the display from shock and environmental damage. They are often used in indoor environments where touch or damage is likely. Impact products are specifically designed for Dual Coat technology for stronger surface durability.
However, even transparent adhesives have the disadvantage of reducing brightness by 4 to 51 TP12T.
COB (Micro LED)
COB
(Chip On Board)
Die-bonding is a method where the chip is attached from the substrate fabrication stage. The LED elements are precisely attached to the substrate. Pixel pitch and small device size High contrast ratioand Super Resolutionfor the first time. Micro LED .
The integrated board is thinner and has better heat dissipation for less heat.
Impact's products are highly power efficient and low heat generation, especially with the use of Flip-chip. They also have dual-coat technology by default, which makes the surface more durable.